{"id":7307,"date":"2025-01-29T23:53:05","date_gmt":"2025-01-29T23:53:05","guid":{"rendered":"https:\/\/intelligence.supplyframe.com\/?p=7307"},"modified":"2025-01-29T23:53:06","modified_gmt":"2025-01-29T23:53:06","slug":"ces-2025-a-chat-with-siemens-eda-ceo-mike-ellow","status":"publish","type":"post","link":"https:\/\/intelligence.supplyframe.com\/ru\/ces-2025-a-chat-with-siemens-eda-ceo-mike-ellow\/","title":{"rendered":"CES 2025: A Chat with Siemens EDA CEO Mike Ellow"},"content":{"rendered":"<p>Siemens showcased its latest PAVE360 digital twin solution this year at CES 2025, lowering the barrier between design efforts that are typically siloed. EE Times had an opportunity to chat with Siemens EDA CEO Mike Ellow about how this approach to design is relevant for the semiconductor industry\u2014especially considering the recent uptick in using AI tools at every level of a system to dynamically assess the trickle up\/down effects of design adjustments.\u00a0<\/p>\n\n\n\n<p><a href=\"https:\/\/www.eetimes.com\/ces-2025-a-chat-with-siemens-eda-ceo-mike-ellow\/\">Read the full article on EETimes<\/a><\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>Siemens showcased its latest PAVE360 digital twin solution this year at CES 2025, lowering the barrier between design efforts that are typically siloed. EE Times had an opportunity to chat with Siemens EDA CEO Mike Ellow about how this approach to design is relevant for the semiconductor industry\u2014especially considering the recent uptick in using AI [&hellip;]<\/p>","protected":false},"author":44,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"content-type":"","footnotes":""},"categories":[104],"tags":[],"class_list":["post-7307","post","type-post","status-publish","format-standard","hentry","category-news"],"blocksy_meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v25.3 (Yoast SEO v25.3) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>CES 2025: A Chat with Siemens EDA CEO Mike Ellow - Supplyframe<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/intelligence.supplyframe.com\/ru\/ces-2025-a-chat-with-siemens-eda-ceo-mike-ellow\/\" \/>\n<meta property=\"og:locale\" content=\"ru_RU\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"CES 2025: A Chat with Siemens EDA CEO Mike Ellow\" \/>\n<meta property=\"og:description\" content=\"Siemens showcased its latest PAVE360 digital twin solution this year at CES 2025, lowering the barrier between design efforts that are typically siloed. 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