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Siemens showcased its latest PAVE360 digital twin solution this year at CES 2025, lowering the barrier between design efforts that are typically siloed. EE Times had an opportunity to chat with Siemens EDA CEO Mike Ellow about how this approach to design is relevant for the semiconductor industry—especially considering the recent uptick in using AI tools at every level of a system to dynamically assess the trickle up/down effects of design adjustments.